Reliability Physics and Engineering Third Edition 2019

Excellent text on reliability physics as it applies to all forms of engineering, but with a bit more emphasis on IC reliability. If you've ever had to contend with time-dependent dielectric breakdown (TDDB), electromigration, hot-carrier injection, negative-bias temperature instability (NBTI), etc., this will give you the fundamentals of where these mechanisms come from and how to model degradation and time-to-failure as functions of time, temperature, voltage stress, etc. The author starts with rock-bottom fundamentals rooted in thermodynamics and builds from there. Numerous real-world examples and practice problems make this one of the most approachable and digestible engineering books I have read.

Test to failure. For work.

This information details what I needed for my project at work.

This gives a detailed overview of mathematical modeling of different failure mechanisms and associated physics behind it. Very well written and a must have book for reliability engineers.